Studi Analisis Evolusi Ukuran Partikel Printed Circuit Board (PCB) Non-treatment Pada Proses Dry Milling = Study of Particle Evolution Analysis of Printed Circuit Board (PCB) Non-treatment in Dry Milling Process

Studi Evolusi Partikel Leached Printed Circuit Board (PCB) pada Proses Wet Milling Menggunakan Process Control Agent Ethanol = Study of the Evolution of Leached Printed Circuit Board (PCB) during Wet Milling Process Using Ethanol as Process Control Agent

Comparative study of electrochemical leaching between multilayer used PCB and double layer plain PCB using sulfuric acid (H2SO4) with concentration variables = Studi perbandingan elektrokimia pada proses pelindian Printed Circuit Board (PCB) bekas multilayer dan Printed Circuit Board (PCB) double layer menggunakan larutan asam sulfat (H2SO4) dengan variable konsentrasi

Pengaruh Persentase Surfaktan Polyethylene Glycol (PEG) dan Persentase Partikel Logam Printed Circuit Board (PCB) Terhadap Zeta Potensial, Konduktivitas Termal, dan Viskositas Thermal Fluids Sebagai Media Pendingin Perlakuan Panas = The Effect of Polyethylene Glycol (PEG) Surfactant Percentage and Metallic Particle Percentage o Printed Circuit Board (PCB) Waste on Zeta Potential, Thermal Conductivity, and Viscosity of Thermal Fluids as Heat Treatment Coolants

Pengaruh Penambahan Partikel Non-logam Hasil Daur Ulang Printed Circuit Board dan Surfaktan Sodium Dodecylbenzene Sulfonate sebagai Media Pendingin Micro dispersed fluid pada Proses Quenching Baja AISI 4140 = The Influence of Adding Non-metal Particle from Recycled Printed Circuit Boards and Sodium Dodecylbenzene Sulfonate Surfactant as a Nanofluid Cooling Medium on the Quenching Process of AISI 4140 Steel