Ditemukan 5 dokumen yang sesuai dengan query
Manko, Howard H.
New York: McGraw-Hill , 1979
671.56 MAN s
Buku Teks Universitas Indonesia Library
Manko, Howard H.
New York: Mir Publishers, 1964
671.56 MAN s
Buku Teks Universitas Indonesia Library
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The topics addressed in this proceedings volume include active brazing (an area of increasing R&D interest); conventional brazing an soldering alloys; wetting and fundamental properties studies; modeling and mechanical analysis and/or characterization; and process technology. All of the papers in this volume have been editorially reviewed. Both the hardcopy and CD contain an author s index for easy reference, and the CD volume is fully searchable by keyword ...
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Materials Park, Ohio: ASM International, 2006
e20451907
eBooks Universitas Indonesia Library
Humpston, Giles
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If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges. Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful use of soldering processes. Priority is given to the fundamental principles that underlie this field of technology rather than recipes for making joints. Striking a ...
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Materials Park, Ohio: ASM International, 2004
e20442559
eBooks Universitas Indonesia Library
Pang, John Hock Lye
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Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead free solder : mechanics and reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure ...
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New York: Springer, 2012
e20418456
eBooks Universitas Indonesia Library
