Ditemukan 5 dokumen yang sesuai dengan query
Afdal Ridho Arman
Abstrak :
Alat ini dibuat untuk memudahkan para pengemudi mobil untuk mencari tempat parkir gedung dan rubanah yang kosong. Alat ini menggunakan System-On-Chip NodeMCU ESP32 Wi-Fi yang diintegrasikan dengan sensor ultrasonic HC-SR04 dan aplikasi android yang dirancang dengan bahasa pemrograman Flutter. Alat utama pada proyek ini adalah sensor ultrasonic HC-SR04 yang bekerja untuk menentukan jarak ke objek mobil dalam ambang batas yang telah ditetapkan dan menjelaskan keberadaan mobil pada parkir mobil yang tersedia. Informasi yang dibaca oleh sensor ditransfer ke NodeMCU ESP32 Wi-Fi, lalu informasi tersebut kemudian ditransfer ke aplikasi android. Aplikasi android diprogram dengan bahasa pemrograman Flutter. Aplikasi akan menampilkan informasi kepada pengguna apakah tempat parkir tersedia atau tidak. Dalam hasil pengujian, perangkat lunak dan perangkat keras pada proyek ini dapat bekerja dengan baik dan dapat membaca keberadaan berbagai jenis mobil dan bukan jenis mobil.
This tool is made to make it easier for car drivers to find an empty parking space and basement. This tool uses the System-On-Chip NodeMCU ESP32 Wi-Fi which is integrated with the HC-SR04 ultrasonic sensor and an android application designed with the Flutter programming language. The main tool in this project is the HC-SR04 ultrasonic sensor to determine the distance to a car within a predetermined threshold and explain the presence of the car in the car park. Information read by the sensor is transferred to NodeMCU ESP32 Wi-Fi, and then it transferred to the android application. The android application is programmed with the Flutter programming language. The application will display information to users whether a parking space is available or not. In the testing result, This project successfully work either in software and hardware, and can read the existence of various types of cars and not cars.
Depok: Fakultas Teknik Universitas Indonesia, 2020
S-Pdf
UI - Skripsi Membership Universitas Indonesia Library
Urwah Syadid Robby Rodiyah
Abstrak :
Kebutuhan akan kompleksitas pada sistem tertanam membuahkan sebuah produk yang disebut SoC (System on Chip). System on Chip adalah sebuah Integrated Circuit (IC) yang mengintegrasikan semua komponen dari sebuah komputer atau sistem elektronik dalam satu buah chip. Untuk mengetahui kondisi dan kemampuan dari Single Board Computer (SBC), harus diukur terlebih dahulu melalui benchmarking. Benchmarking dilakukan pada komponen SoC, yaitu prosesor, GPU, dan RAM pada Raspberry Pi 2, Intel Galileo Gen 2, dan Cubieboard 1. Hasil menunjukkan Intel Galileo memiliki performa buruk dalam melaksanakan komputasi kompleks. Dari delapan kriteria penilaian, Galileo mempunyai lima skor terburuk dengan rata-rata beban maksimal CPU 58% dan RAM 31.4% dan rata-rata temperatur adalah 55.8℃. Raspberry Pi 2 adalah yang terbaik dengan rata-rata beban maksimal CPU 43% dan RAM 15.8% dengan rata-rata maksimal temperatur adalah 52℃.
The need for complexity in embedded systems produce a product called SoC (System on Chip). System on Chip is an Integrated Circuit (IC) that integrates all the components of a computer or electronic system in a single chip. To determine the condition and capabilities of the Single Board Computer (SBC), must be measured in advance through benchmarking. Benchmarking conducted on SoC components, there are processor, GPU, and RAM on the SBC type such as Raspberry Pi 2, Intel Galileo Gen 2, and Cubieboard 1. Results showed Intel Galileo has a bad performance in executing complex computing. Of the eight assessment criteria, Galileo has five scores worst with an average load of 58% maximum CPU and RAM 31.4% and the average temperature is 55.8℃. Raspberry Pi 2 is the best performance with an average load of 43% maximum CPU and RAM 15.8% with an average maximum temperature is 52℃.
2016
S62423
UI - Skripsi Membership Universitas Indonesia Library
Abstrak :
In this new edition of the Handbook of Signal Processing Systems, many of the chapters from the previous editions have been updated, and several new chapters have been added. The new contributions include chapters on signal processing methods for light field displays, throughput analysis of dataflow graphs, modeling for reconfigurable signal processing systems, fast Fourier transform architectures, deep neural networks, programmable architectures for histogram of oriented gradients processing, high dynamic range video coding, system-on-chip architectures for data analytics, analysis of finite word-length effects in fixed-point systems, and models of architecture.
There are more than 700 tables and illustrations; in this edition over 300 are in color.
This new edition of the handbook is organized in three parts. Part I motivates representative applications that drive and apply state-of-the art methods for design and implementation of signal processing systems; Part II discusses architectures for implementing these applications; and Part III focuses on compilers, as well as models of computation and their associated design tools and methodologies.
Switzerland: Springer Cham, 2019
e20502863
eBooks Universitas Indonesia Library
Bozanic, Mladen
Abstrak :
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Switzerland: Springer Nature, 2019
e20509638
eBooks Universitas Indonesia Library
Abstrak :
This handbook presents fundamental knowledge on the hardware/software (HW/SW) codesign methodology. Contributing expert authors look at key techniques in the design flow as well as selected codesign tools and design environments, building on basic knowledge to consider the latest techniques. The book enables readers to gain real benefits from the HW/SW codesign methodology through explanations and case studies which demonstrate its usefulness.
Readers are invited to follow the progress of design techniques through this work, which assists readers in following current research directions and learning about state-of-the-art techniques. Students and researchers will appreciate the wide spectrum of subjects that belong to the design methodology from this handbook.
Dordrecht: Springer Dordrecht, 2019
e20509531
eBooks Universitas Indonesia Library