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"Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions."

"Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead free solder : mechanics and reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests."

"Physics of nanostructured solid state devices introduces readers to theories and concepts such as semi-classical and quantum mechanical descriptions of electron transport, methods for calculations of band structures in solids with applications in calculation of optical constants, and other advanced concepts. The information presented here will equip readers with the necessary tools to carry out cutting edge research in modern solid state nanodevices."

"This book provides an overview of automatic test pattern generation (ATPG) and introduces novel techniques to complement classical ATPG, based on Boolean Satisfiability (SAT). A fast and highly fault efficient SAT-based ATPG framework is presented which is also able to generate high-quality delay tests such as robust path delay tests, as well as tests with long propagation paths to detect small delay defects."

"This book covers the recent development of the interdisciplinary use of sensors for data collection, systems analysis and monitoring. It presents the latest in theory and practice across a variety of fields such as engineering, biomedicine, and the military."

"This book describes the design of low-voltage analog integrated filters using current mirrors, one of the most common building blocks both in analog and mixed-signal VLSI circuits, offering the advantages of low-voltage operation, derivation of resistorless topologies and electronic adjustment capability of their frequency characteristics. Several design examples are described, using current mirrors that fulfill the requirements of modern low-power wireless and biomedical applications, such as universal biquadratic filter topologies, complex filters for Bluetooth/ZigBee low-IF receivers and Wavelet filters for cardiac signal detection. The experimental results from the fabricated chips will also be presented, showing their utility in modern low-voltage low-power portable devices."

"This book introduces Open Core Protocol (OCP) not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics. Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate. The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs."

"This book provides detailed and accurate information on the history, structure, operation, benefits and advanced structures of silicon MESFET, along with modeling and analysis of the device. The authors explain the detailed physics that are important in modeling of SOI-MESFETs, and present the derivations of compact model expressions so that users can recognize the physical meaning of the model equations and parameters. The discussion also includes advanced structures for SOI-MESFET for submicron applications."

"This book gathers the best papers presented at the Fourth Italian National Conference on Sensors, held in Catania, Italy, from 21 to 23 February 2018. The book represents an invaluable and up-to-the-minute tool, providing an essential overview of recent findings, strategies and new directions in the area of sensor research. Further, it addresses various aspects based on the development of new chemical, physical or biological sensors, assembling and characterization, signal treatment and data handling. Lastly, the book applies electrochemical, optical and other detection strategies to relevant issues in the food and clinical environmental areas, as well as industry-oriented applications."

"The book presents high-quality papers from the Third International Conference on Microelectronics, Computing & Communication Systems (MCCS 2018). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communications, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems, and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements, and testing. The applications and solutions discussed in the book provide excellent reference material for future product development."