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Ditemukan 47 dokumen yang sesuai dengan query
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Oliveira, Joao P., author
This book is dedicated to the analysis of parametric amplification with special emphasis on the MOS discrete-time implementation. This implementation is demonstrated by the presentation of several circuits where the MOS parametric amplifier cell is used, small gain amplifier, comparator with embedded pre-amplification, discrete-time mixer/IIR-Filter, and analog-to-digital converter (ADC). ...
New York: Springer, 2012
e20418414
eBooks  Universitas Indonesia Library
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Wolpert, David, author
This book discusses new techniques for detecting, controlling, and exploiting the impacts of temperature variations on nanoscale circuits and systems. A new sensor system is described that can determine the temperature dependence as well as the operating temperature to improve system reliability. A new method is presented to control a...
New York: [, Springer], 2012
e20418484
eBooks  Universitas Indonesia Library
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Shashank Priya, editor
Ecological restrictions in many parts of the world are demanding the elimination of Pb from all consumer items. At this moment in the piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics is to provide a comprehensive overview...
New York: [, Springer], 2012
e20418644
eBooks  Universitas Indonesia Library
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Boyd, Sarah B., author
Life-cycle assessment of semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in...
New York: Springer, 2012
e20418652
eBooks  Universitas Indonesia Library
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Tomi Laurila, author
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this revised method four fundamental disciplines are combined, (i) thermodynamics of...
London : Springer, 2012
e20425845
eBooks  Universitas Indonesia Library
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Gaillardon, Pierre-Emmanuel, author
This book discusses the opportunities offered by disruptive technologies to overcome the economical and physical limits currently faced by the electronics industry. It provides a new methodology for the fast evaluation of an emerging technology from an architectural prospective and discusses the implications from simple circuits to complex architectures. Several...
New York: [, Springer], 2012
e20418197
eBooks  Universitas Indonesia Library
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Kazmierski, Tom J., editor
This book brings together a selection of the best papers from the thirteenth edition of the Forum on specification and Design Languages Conference (FDL), which was held in Southampton, UK in September 2010. FDL is a well established international forum devoted to dissemination of research results, practical experiences and...
New York: [Springer, ], 2012
e20418367
eBooks  Universitas Indonesia Library
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Qiaoyan Yu, author
This book addresses reliability and energy efficiency of on-chip networks using cooperative error control. It describes an efficient way to construct an adaptive error control codec capable of tracking noise conditions and adjusting the error correction strength at runtime. Methods are also presented to tackle joint transient and permanent error...
New York: [Springer, ], 2012
e20418433
eBooks  Universitas Indonesia Library
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Yong, Liu, author
Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor...
New York: [, Springer], 2012
e20418439
eBooks  Universitas Indonesia Library
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Pang, John Hock Lye, author
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards....
New York: Springer, 2012
e20418456
eBooks  Universitas Indonesia Library
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