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"In this paper we present a new method to increase the lateral resolution available in laser scanning failure analysis tools. By fabricating a diffractive lens on the back side of the die, the area of the circuit of interest, directly underneath the lens, may be studied with a lateral resolution up to 3.5 times better than without the lens. This method is easily implemented with standard equipment already present in most failure analysis laboratories, and overcomes some significant problems encountered with alternative resolution enhancing schemes"

"Contents :- Laser Voltage Probe (LVP): A Novel Optical Probing Technology for Flip-Chip Packaged Microprocessors - Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation - Application of Single Contact Optical Beam Induced Currents (SCOBIC) for Backside Failure Analysis - Measurement of Interfacial Adhesion and Its Degradation in Multi-Layer Packages, Devices, And Blanket Films Using the Laser Spallation Technique - New FIB-Supported Approach for Wirebond Characterization - Failure Analysis of Flip Chip Bumps after Thermal Stressing - X-Ray Tomography for Electronic Packages - Data Analysis Tools and Methodologies for Quick Yield Learning in a High Volume Manufacturing Environment - Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication - Embedded Memory Analysis for Standard Cell ASIC Yield Enhancement - Yield Enhancement Study: Process Variation and Design Margins Leading to Timing Issues in RAM - In-line Defect to Bitmap Signature Correlation: A Shortcut to Physical FA Results - Analysis of Leakage Failures in Flash Memory Devices and Root Cause Identification - Passive Voltage Contrast Application on Analysis of Gate Oxide Failure in 0.25 μm Technology - Forensic Microscopy in the Failure Analysis Laboratory - Failure Analysis Process Flow and Common Failure Mechanisms in Flip-Chip Packaged Devices - A Study on the Yield Loss Due to Al (Cu) Interconnections with Spacing Failure - Near IR Absorption in Heavily Doped Silicon–An Empirical Approach - Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement - LSI Process Diagnosis for Device Users - Application of KOH Electrochemical Etch and Passive Voltage Contrast Techniques to Identify Leaky Gate in Deep Submicron CMOS - UV Reflectance Spectroscopy of the Copper/Copper Oxide System for Assessment of Solderability - Antireflection Coatings for Semiconductor Failure Analysis - Comparative Study of Sample Preparation Techniques for Backside Analysis - A Comparison of Backside Emission Microscopy Systems - Failure Analysis from the Back Side of a Die - ESD Effects on Electromigration Performance of Aluminum Metallization System - Evaluation of On-Chip ESD Supply Clamp Robustness by In-situ Floating Power Bus Monitoring - Transmission Line Pulse Testing of the ESD Protection Structures of ICs.-A Failure Analysts Perspective - Failure Analysis of CDM ESD Damage in a GaAs RFIC - A Focused Ion Beam Technique to Electrically Contact the Deep Trench Capacitor of a Single Active Memory Cell in the Sub 0.25 μm Technology Regime - The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures - Selective Au Etching in Au/Al Bonds in Current IC Technology - A Novel Method to Analyze the Deep Trench Capacitors in DRAM - Identification and Analysis of Parasitic Depletion Mode Leakage in a Memory Select Transistor - Thermal Fatigue Induced Voiding in LDMOS Transistors Submitted to Multiple Energy Discharges - Humidity-Bias Driven Shorts in Multilayer Circuits: A Case Study in Failure Analysis - Passivation Cracks in a Four-Level Metal Low-k Dielectric Backend Process - Electronic Package Failure Analysis Using TDR - Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool - Contrast Inversions in Scanning Acoustic Microscopy (C-SAM) of Glue Die Attach - Application of Scanning Acoustic Microscopy tom Electric and Electronic Parts - Combining FIB Sequential Cross-Sectioning With TEM for Small Defect Analysis in SRAM Array - Failure Analysis of Tungsten Stud Defects from the CMP Process - Integrated Circuit SNR Improvement using Dielectric Altering Compound, Laser Trim, and FIB system - Characterization and Isolation Techniques in Silicon on Insulator Technology Microprocessor Designs - Failure Analysis of Stacked-Chip Scale Package - Reducing Top-of-Die Plastic Delamination by Assuring Pre-Mold Cleanliness of Die Surfaces - SMT Ceramic Capacitor Failure Mechanisms, Isolation Tools, Techniques and Analysis Methods - Case Studies of Brittle Interfacial Failures in Area Array Solder Interconnects - Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing - High Temperature Solder (Au/Sn) Failures from Nickel Plating Impurities - Semiconductor Wear Out at Nuclear Power Plants - UTC Clinic Hospital Network: Description of International Network of Failure Analysis Labs and Case Studies - Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on- Index"

"This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results."

"Contents :- IPFA 2002 Best Paper Award Winner - SEM/SThM-Hybrid-System: A New Tool for Advanced Thermal Analysis of Electronic Devices - From Microns to Molecules–Can FA Remain Viable Through the Next Decade? - Soft Defect Localization (SDL) on ICs - Fault Localization and Functional Testing of ICs by Lock-in Thermography - Visualisation of Electrically Active Areas Using Electron Holography - A Study of Photoelectron Emission Microscopy Contrast Mechanisms Relevant to Microelectronics - Application of Acoustic Fourier Domain Imaging for the Evaluation of Advanced Micro Electronic Packages - Orientation Imaging Microscopy Applications in Cu-Interconnects and Cu-Cu Wire Bonding - Materials Analysis and Process Monitoring in MegaFabs - STEM (Scanning Transmission Electron Microscopy) in a SEM (Scanning Electron Microscope) for Failure Analysis and Metrology - Microcalorimeter Energy Dispersive X-Ray Spectroscopy in Routine Semiconductor Failure Analysis - A Working Method for Adapting the (SEM) Scanning Electron Microscope to Produce (STEM) Scanning Transmission Electron Microscope Images - Applications of EELS to Semiconductor Devices Failure Analysis by Using a 300 keV TEM - Laser Milling Methods for Package Failure Analysis - Laser Decapsulation of Transfer Molded Plastic Packages for Failure Analysis - Investigation of Microstructure Change on Ni-based UBM Systems in Lead Free Solder - Failure Analysis Strategy For 2 Stacked Die CSP - Evaluation of Package Defects by Thermal Imaging Techniques - Backside Hot Spot Detection - Optimizing Backside Image Quality - Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and Limitations - Failure Analysis of Tungsten Contact Failure in a 0.13 um CMOS Process - Backside Photoemission and Infrared Microthermography for Rapid Debug of Compound Semiconductor Devices - Laser-Voltage-Prober Measurements on Bipolar Devices - Application of Focused Ion Beam in Debug and Characterization of 0.13 um Copper Interconnect Technology - Thin-Die Flip Chip Physical-FA Process Flow - Failure Mechanism and Rootcause Analysis of UBGA Solder Ball Contamination - Passivation Damage and Residue-Induced Package Failure Analysis For a 16 Lead SOIC GaAs RF/IF Package - Study on a Single NFET Degradation After Circuit Modification with FIB - New Techniques to Improve the Efficiency of TEM Sample Preparation - A Transmission X-Ray Microscope (TXM) for Non-Destructive 3D Imaging of ICs at Sub-100 nm Resolution - A Broadband Model for Ultrasonic Pulses in the Presence of Thin Layers in Microelectronics - Beam-Based Localization Techniques for 0.18 um IC Failure Analysis after Reliability Test - Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers that Use GHz Mixed Signal ICs - Application of Various Fault Localization Techniques to Different Types of 6T- SRAM column Failures - Missing Metal Pillar Failure Analysis-A Plug Technology Issue - Reliability and failure analysis of RF MEMS switches - Failure Analysis of Polysilicon Micromirror Arrays - Failure Analysis of the Digital Micromirror Device - Wavefront Coded Imaging Systems for MEMS Analysis - Sample preparation for Vertical Transistors in DRAM - A Methodology to Reduce Ion Beam Induced Damage in TEM Specimens Prepared by FIB - CMOS Backside Deprocessing With TMAH/IPA as a Sample Preparation Procedure for Failure Analysis - Investigation of Choline Hydroxide for Selective Silicon Etch from a Gate Oxide Failure Analysis Standpoint - In situ Decapsulation of Plastic Encapsulated Devices Mounted to a Printed Circuit Board - A Standardized Scientific Method Formulation for Failure Analysis Application - Probeless FA Approach: a Breakthrough Simulation Based Failure Analysis Method - Electrical Faults Captured by In-Line E-beam Inspection and Failure Analysis - Effect of Corner Underfill Voids on Chip Scale Package (CSP) Performance Under Mechanical Loading - Leakage Isolation of Mixed-Signal Devices at Operating Modes - Method for Measuring Package to Board Interconnection Shear Strength for Area Array, Fine Pitch Packages - Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits - Scanning SQUID Microscopy for Die Level Fault Isolation - A Successful Failure Localization Approach for Defect Identification on High Resistance Interconnects - Backside FIB Device Modifications Through the BOX Layer of an SOI Device - Coax"