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"This book gathers the proceedings of the 12th International Conference on Measurement and Quality Control-Cyber Physical Issues (IMEKO TC 14 2019), held in Belgrade, Serbia, on 4-7 June 2019. The event marks the latest in a series of high-level conferences that bring together experts from academia and industry to exchange knowledge, ideas, experiences, research findings, and information in the field of measurement of geometrical quantities. The book addresses a wide range of topics, including: 3D measurement of GPS characteristics, measurement of gears and threads, measurement of roughness, micro- and nano-metrology, laser metrology for precision measurements, cyber physical metrology, optical measurement techniques, industrial computed tomography, multisensor techniques, intelligent measurement systems, evaluating measurement uncertainty, dimensional management in industry, product quality assurance methods, and big data analytics. By providing updates on key issues and highlighting recent advances in measurement and quality control, the book supports the transfer of vital knowledge to the next generation of academics and practitioners."

"This book covers a variety of topics related to the Industry 4.0 concept, with a special emphasis on the efficiency of production processes and innovative solutions for smart factories. It describes tools supporting this concept in both the mechanical engineering and biomedical engineering field. The content is based on papers presented at the 6th International Scientific-Technical Conference MANUFACTURING 2019, held on 19-22 May 2019, in Poznan, Poland. Virtual reality, simulation of manufacturing systems, additive manufacturing, big data analysis, automation and application of artificial intelligence, as well as economic and social issues related to the integration of those technologies are just some of the topics discussed here. All in all, the book offers a timely and practice-oriented reference guide for researchers and practitioners, and is expected to foster better communication and closer cooperation between universities and their business and industrial partners."

"This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems."

"This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2018 ApplePies Conference, held in Pisa, Italy in September 2018, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. "

"This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers."

"This book presents select proceedings of the International Conference on Future Learning Aspects of Mechanical Engineering (FLAME 2018). The book covers mechanical design areas such as computational mechanics, finite element modeling, computer aided designing, tribology, fracture mechanics, and vibration. The book brings together different aspects of engineering design, and will be useful for researchers and professionals working in this field."

"This book constitutes the joint refereed proceedings of the 12 International Conference on Next Generation Teletraffic and Wired/Wireless Advanced Networking, NEW2AN, and the 5th Conference on Internet of Things and Smart Spaces, ruSMART 2012, held in St. Petersburg, Russia, in August 2012. The total of 42 papers was carefully reviewed and selected for inclusion in this book. The 14 papers selected from ruSMART are organized in topical sections named, defining an internet-of-things ecosystem, future services, and smart space governing through service mashups. The 28 papers from NEW2AN deal with the following topics, wireless cellular networks, ad-hoc, mesh, and delay-tolerant networks, scalability, cognition, and self-organization, traffic and internet applications, and wireless sensor networks. They also contain 4 selected papers from the NEW2AN 2012 winter session."

"This book gathers selected papers presented at the 7th International Conference on Innovations in Electronics and Communication Engineering, held at Guru Nanak Institutions in Hyderabad, India. It highlights contributions by researchers, technocrats and experts regarding the latest technologies in electronic and communication engineering, and addresses various aspects of communication engineering, including signal processing, VLSI design, embedded systems, wireless communications, and electronics and communications in general. Covering cutting-edge technologies, the book offers a valuable resource, especially for young researchers. "

"The two-volume set LNCS 7289 and 7290 constitutes the refereed proceedings of the 11th International IFIP TC 6 Networking Conference held in Prague, Czech Republic, in May 2012. The 64 revised full papers presented were carefully reviewed and selected from a total of 225 submissions. The papers feature innovative research in the areas of network architecture, applications and services, next generation Internet, wireless and sensor networks, and network science. The second volume includes 32 papers and is organized in topical sections on video streaming, peer to peer, interdomain, security, cooperation and collaboration, DTN and wireless sensor networks, and wireless networks."

"This book constitutes the refereed proceedings of the 13th International Conference on Passive and Active Measurement, PAM 2012, held in Vienna, Austria, in March 2012. The 25 revised full papers presented were carefully reviewed and selected from 83 submissions. The papers were arranged into eight sessions traffic evolution and analysis, large scale monitoring, evaluation methodology, malicious behavior, new measurement initiatives, reassessing tools and methods, perspectives on internet structure and services, and application protocols."