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"This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. "

"This work reviews the current state of the art in metallic microlattice structures, manufactured using the additive manufacturing processes of selective laser melting, electron beam melting, binder jetting and photopolymer wave guides. The emphasis is on structural performance (stiffness, strength and collapse).The field of additively manufactured metallic microlattice structures is fast changing and wide ranging, and is being driven by developments in manufacturing processes. This book takes a number of specific structural applications, viz. sandwich beams and panels, and energy absorbers, and a number of conventional metallic materials, and discusses the use of additive manufactured metallic microlattice structures to improve and enhance these structural performances. Structural performances considered includes such non linear effects as plasticity, material rupture, elastic and plastic instabilities, and impact loading. The specific discussions are put into the context of wider issues, such as the effects of realisation processes, the effects of structural scale, use of sophisticated analysis and synthesis methodologies, and the application of existing (conventional) structural theories. In this way, the specific discussions are put into the context of the emerging general fields of Architectured (Architected) Materials and Mechanical Metamaterials."

"Molecular modeling and multiscaling issues for electronic material applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications. Part I presents the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue. Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues. Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes. Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials. Finally, part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level."

"ABSTRAKFokus riset ini adalah pentingnya upaya untuk mencapai konservasi nilai material terutama untuk desain produk kemasan plastik fleksibel dengan penggunaan warna dan tinta cetak yang berlebihan akan berdampak pada rendahnya tingkat penerimaan limbah plastik untuk didaur ulang. Pada riset ini memiliki dua tujuan riset, tujuan pertama untuk mengusulkan desain kriteria konservasi nilai material untuk kemasan plastik fleksibel menggunakan pengembangan metode kriteria design for recycling, metode delphi, kuesioner, uji validasi dan reliabilitas, dan analisis faktor untuk menentukan kecukupan data nya. Tujuan kedua melakukan desain ulang konservasi nilai material untuk kemasan plastik fleksibel dengan menggunakan metode observasi, redefining method, dan metode pemberian skor. Proses desain ulang didasarkan pada ketidaksesuaian desain awal dengan desain kriteria konservasi nilai material nya. Hasil riset didapatkan bahwa uji validasi dan reliabilitas untuk rekomendasi terbaik dari desain kriteria didapatkan; (1) Tidak ada pigmen warna pada permukaan material plastik, (2) Warna putih pada permukaan material plastik, (3) Tidak ada tinta cetak dalam pewarnaan, simbol, gambar, grafik dan huruf pada permukaan material plastik, (4) Penggunaan label kertas secara optimal atau label plastik tipis sebagai tujuan informasi dan promosi pengemasan, (5) Tidak ada perekat atau perekat yang larut dalam air atau material perekat yang tidak beracun, dan (6) Meminimumkan penggunaan lapisan (layer) pada proses pembetukan desain kemasan. Sedangkan pada proses desain ulang menunjukkan tingkat penerimaankonsumen yang tinggi untuk desain ulang kemasan plastik fleksibel yang diusulkan dan usulan desain ulang tersebut masih dapat mempertahankan fungsi dari kemasan yaitu sebagai wadah, identifikasi produk dan informasi produk. Penerapan desain kriteria dan desain ulang pada konservasi nilai material untuk kemasan plastik fleksibel diharapkan dapat sebagai referensi untuk mengembangkan inovasi desain kemasan oleh pemangku kepentingan terkait dengan memperhatikan dari aspek kualitas material plastiknya sebelum digunakan sebagai kemasan supaya harga jual hasil daur ulangnya dapat meningkat.

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ABSTRACTFocus of this study is the importance of effort to attain material valueconservation, particularly for design of flexible plastic packaging with excessive use of color and printing ink will be affected to the low acceptance level of plastic waste for recycling. This research have two purposes such as to proposed design criteria for material value conservation of flexible plastic packaging using design of recyclingmethod, delphi method, questionnaire, validation and reliability test, and factor analysis to determine the adequacy data. Next purpose is redesign flexible plastic packaging for material value conservation using observation method, redefining method, and scoring method. Redesign process will be based on incompatibility of the initial design with design criteria of material value conservation. The results found that validation and reliability tests for the best recommendations from design criteria flexible plastic packaging consist of; (1) No pigment color in plastic material, (2) White color in plastic material, (3) No printing ink in coloration, symbols, pictures, graph and letters on thesurfaces of plastic materials, (4) Optimum use of paper label or thin plastic label as informational and promotional purposes of packaging, (5) No adhesive or water-soluble adhesive and non-toxic material, and (6) Recycle-able material with good value and minimum category of the layer used for packaging. Futhermore, the results of redesign flexible plastic packaging has been shown a high level of consumer acceptance for the proposed design flexible plastic packaging and those design still maintain the function of the packaging as a protecting product, product identification and product information. Implementation of design criteria and the proposed redesign for material value conservation of flexible plastic packaging could be as a reference to develop the phase of innovation design for related stakeholders by paying attention on aspects the quality of material plastic before being used as packaging in order to increase its selling price in recycling processes."

"Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions."

"This SpringerBrief focuses on modeling and power evaluation of high-speed craft. The various power prediction methods, a principal design objective for high-speed craft of displacement, semi-displacement, and planing type, are addressed. At the core of the power prediction methods are mathematical models for resistance and propulsion efficiency. The models are based on the experimental data of various high-speed hull and propeller series. The regression analysis and artificial neural network (ANN) methods are used as an extraction tool for this kind of mathematical models. A variety of mathematical models of this type are discussed in the book.Once these mathematical models have been developed and validated, they can be readily programmed into software tools, thereby enabling the parametric analyses required for the optimization of a high-speed craft design. This book provides the foundational reference for these software tools, and their use in the design of high-speed craft. High-speed craft are very different from conventional ships. Current professional literature leaves a gap in the documentation of best design practices for high-speed craft. This book is aimed at naval architects who design and develop various types of high-speed vessels."

"This book develops the analytical theory of perfectly conducting and lossy metal, circular, round-wire loop antennas and nano-scaled rings from the radio frequency (RF) regime through infrared and the optical region. It does so from an antenna theory perspective. It is the first time that all of the historical material found in the literature has appeared in one place. It includes, particularly, material that has appeared in the literature only in the last decade and some new material that has not yet been published. The book derives the input impedance, resonances and anti-resonances, the RLC circuit model representation, and radiation patterns not only of closed loops and rings, but also of loops and rings loaded randomly and multiply with resistive and reactive impedances. Every derivation is compared with simulations run in Microwave Studio (MWS). It looks carefully at the physical response of loop antennas and nano-rings coupled to a source at one point in the periphery and at such rings illuminated by a plane wave arriving from every different direction with the E-field in all polarizations. The book ends with a brief look at polygonal loops, two dimensional arrays of nano-rings, and Yagi-Uda arrays."