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"Priced for clearance sale! Price was $134. Save $109! The overwhelming success of this second Materials and Processes for Medical Devices conference can be attributed to the balanced coverage of medical device technology, new materials, new processes, testing issues, regulatory issues, and specific device application concerns."
Materials Park, Ohio: ASM International, 2005
e20442677
eBooks  Universitas Indonesia Library
cover
"This volume includes contributions from the world?s foremost experts from academia, industry, and national laboratories involved in cardiac, vascular, neurological, and orthopaedic implants, dental devices, and surgical instrumentation/devices. Topics covered include: fabrication, fatigue, corrosion, tissue biocompatibility, cell-surface interactions, regulatory issues, shape memory alloys and a host of other cutting edge subjects."
Materials Park, Ohio: ASM International, 2010
e20452350
eBooks  Universitas Indonesia Library
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"In this proceedings volume, professionals from the medical device industry and their suppliers share technological and scientific knowledge, as well as insights into the latest innovations."
Materials Park, Ohio: ASM International, 2004
e20442679
eBooks  Universitas Indonesia Library
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"The Materials & Processes for Medical Devices Conference focuses on the materials science and engineering aspects of the medical devices industry. Device manufacturers, materials providers, and clinicians share information and knowledge on materials and their properties. Coverage ranges from cardiovascular devices to orthopedics to dental appliances."
Materials Park, Ohio: ASM International, 2006
e20451921
eBooks  Universitas Indonesia Library
cover
"Proceedings from the only conference on medical devices that brings together scientists and product, research, design and development engineers from around the globe to present the latest developments in materials, processes, product performance and new technologies for medical/dental devices.
This volume includes contributions from the world?s foremost experts from academia, industry, and national laboratories involved in cardiac, vascular, neurological, and orthopaedic implants, dental devices, and surgical instrumentation/devices.
Materials addressed include biomedical alloys (stainless steels, titanium alloys, cobalt-chromium alloys, nickel-titanium alloys, noble and refractory metals) biopolymers, bioceramics, surface coatings, and nanomaterials.
Topics covered include: degradation, wear fracture, corrosion, processing, biomimetics, biocompatibility, bioelectric phenomena and electrode behavior, surface engineering, and cell-material interactions.
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Materials Park, Ohio: ASM International, 2008
e20451923
eBooks  Universitas Indonesia Library
cover
"Features a number of reviews documenting the properties and failure mechanisms of metallic implant materials. Covers body/oral environment and its impact on implant material performance, the basic concepts of biocompatibility, tissue attachment mechanisms, biophysical and biomechanical requirements of implant materials, and more."
Materials Park, Ohio: ASM International, 2003
e20442685
eBooks  Universitas Indonesia Library
cover
"Contents :
- Recent Developments in Weldability Testing for Advanced Materials
- Reactive Air Brazing for High-Temperature Electrochemical Applications
- The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on
Silver-Based Filler Metal Compositions
- Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High
Strength Steels
- Important Lessons Learnt in the Design of Consumables for Welding High
Strength Steels
- The Development of a Compressive Residual Stress Around a Structural Steel
Weld by Means of Phase Transformations
- Micro Electron Beam Welding in an SEM
- Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s
Corrosion Resistance
- The Effect of Surface Tension on Microjoining
- Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating
- Room Temperature Lead-Free Soldering of Microelectronic Components using a
Local Heat Source
- Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder
and Au/Ni-Co Plating
- Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution
- Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure
Development in Laser Surface Melting of Single Crystal Superalloys
- Weldability of Ni-Base Single Crystal Superalloys
- Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111
- Designing Sealing Glasses for Solid Oxide Fuel Cells
- Glass-Ceramics for Sealing Solid Oxide Fuel Cells
- Compressive Mica Seals for Solid Oxide Fuel Cells
- High Temperature Seals for Solid Oxide Fuel Cells (SOFC)
- A New Sealing Concept for Planar Solid Oxide Fuel Cells
- Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd:
YAG Laser Irradiation
- Damage Control of Soldering Iron Tip for Lead-Free Solder
- Resistance Microwelding of Fine Nickel Wires
- Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding
Conditions -
- YAG Laser and TIG Arc Hybrid Welding Phenomena
- Effect of Joint Design on Mechanical Properties of AL7075 Weldment
- Properties of Weld Joints of Bake-Hardening Steel for Automobile
- Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-
Industry Design Project Collaboration
- Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base
Metal
- Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-
Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land "
Materials Park, Ohio: ASM International, 2005
e20442560
eBooks  Universitas Indonesia Library
cover
"Comprehensive in scope, this book covers the latest progresses of theories, technologies and applications of LEDs based on III-V semiconductor materials, such as basic material physics, key device issues (homoepitaxy and heteroepitaxy of the materials on different substrates, quantum efficiency and novel structures, and more), packaging, and system integration. The authors describe the latest developments of LEDs with spectra coverage from ultra-violet (UV) to the entire visible light wavelength. The major aspects of LEDs, such as material growth, chip structure, packaging, and reliability are covered, as well as emerging and novel applications beyond the general and conventional lightings. This book, written by leading authorities in the field, is indispensable reading for researchers and students working with semiconductors, optoelectronics, and optics.
- Addresses novel LED applications such as LEDs for healthcare and wellbeing, horticulture, and animal breeding;
- Editor and chapter authors are global leading experts from the scientific and industry communities, and their latest research findings and achievements are included;
- Foreword by Hiroshi Amano, one of the 2014 winners of the Nobel Prize in Physics for his work on light-emitting diodes."
Switzerland: Springer Nature, 2019
e20509158
eBooks  Universitas Indonesia Library
cover
Young, James F.
New York: John Wiley & Sons, 1959
669 YOU m
Buku Teks SO  Universitas Indonesia Library
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"This proceedings volume includes papers covering all aspects of surface engineering, ranging from novel technologies to industrial applications."
Materials Park, Ohio: ASM International, 2006
e20451842
eBooks  Universitas Indonesia Library
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