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"Contents :- Introduction - Engineering Plastics: An Introduction - Effects of Composition, Processing, and Structure on Properties of Engineering Plastics* - Materials Selection and Design of Engineering Plastics - General Design Guidelines* - Design with Plastics* - Design and Selection of Plastics Processing Methods - Physical, Chemical, and Thermal Analysis of Plastics - Physical, Chemical, and Thermal Analysis of Thermoset Resins* - Physical, Chemical, and Thermal Analysis of Thermoplastic Resins* - Thermal Analysis and Thermal Properties* - Environmental and Chemical Effects - Characterization of Weathering and Radiation Susceptibility* - Flammability Testing* - Electrical Testing and Characterization* - Optical Testing and Characterization* - Mechanical Behavior and Wear - Mechanical Testing and Properties of Plastics: An Introduction* - Creep, Stress Relaxation, and Yielding* - Crazing and Fracture* - Fracture Resistance Testing* - Impact Loading and Testing* - Fatigue Testing and Behavior* - Fatigue Failure Mechanisms* - Friction and Wear Testing* - Wear Failures of Plastics* - Wear Failures of Reinforced Polymers* - Environmental Effects - Thermal Stresses and Physical Aging* - Environmental Stress Crazing* - Moisture-Related Failure* - Organic Chemical Related Failure* - Photolytic Degradation* - Microbial Degradation* - Failure Analysis of Plastics - Analysis of Structure* - Characterization of Plastics in Failure Analysis* - Surface Analysis - Fracture and Fractography - Fractography of Composites* - Reference Information - Abbreviations and Symbols - Index "

"Systems Failure Analysis gives your product teams the tools and concepts to get at the root causes of defects and failures in complex manufacturing and engineered systems. Whether the failure is a ?show stopper? that brings an organization to a halt, or if your team wants to find and correct root causes of unacceptable variations in a system, the methods described in Systems Failure Analysis can help you identify and evaluate all potential failure causes, not just by jumping to conclusions on the perceived obvious ones. Quantifying the ?hidden factory? of process variations also can help prevent failures and improve productivity and yields by reducing scrap or rework."

"Buku yang berjudul "Dictionary of plastics" ini ditulis oleh J. A. Wordingham dan P. Reboul. Buku ini merupakan sebuah kamus mengenai plastik."

"Contents :- Foreword - The Microelectronics Desk Reference - System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in today’s High Speed Low Cost PC environment - Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products - Failure Analysis Flow for Package Failures - Wafer Level Failure Analysis Process Flow - Flip-Chip and “Backside” Sample Preparation Techniques - Failure Analysis in a Fabless/Outsourced World - Circuit Edit at First Silicon - The Process of Editing Circuits Through the Bulk Silicon - Curve Tracer Data Interpretation for Failure Analysis - A Primer on Simple Device Problems and Curve Tracer Characteristics - Electronics and Failure Analysis - Analog Device and Circuit Characterization - IC Testing: Background, Directions and Opportunities for Failure Analysis - Using Scan Based Techniques for Fault Isolation in Logic Devices - The Power of Semiconductor Memory Failure Signature Analysis - Common Defects Encountered During Semiconductor Manufacturing - System Level Board Fabrication and Assembly Process Anomalies and Associated Failures Categories - Characterization of Anomalies in Flip-Chip Solder Joins in Ceramic Packaging - Identification of Latent Defects in Advanced Glass Ceramic MCM Packaging - Electrostatic Discharge (ESD) and Latchup Failures in Advanced CMOS Technologies - Electrical and Optical Characterization of Latchup - Failure Analysis of Microelectromechanical Systems (MEMS) - Failure Analysis of Passive Components - Failure Analysis and Reliability of Optoelectronic Devices - Die-level Fault Localization with X-ray Microscopy - X-ray Microtomography Tools for Advanced IC Packaging Failure Analysis - Acoustic Microscopy of Semiconductor Packages - Electronic Package Fault Isolation Using TDR - Current Imaging using Magnetic Field Sensors - Chip access techniques - Low Stress FA Sample Preparation of Flip Chip Devices with Low-K Dielectric Interconnect Layers - Plastic BGA Module FA Process Flow Development - Chip-Scale Packages and Their Failure Analysis Challenges - Backside Analysis Using Re-Package Techniques - Photon Emission Microscopy - Fundamentals of Photon Emission (PEM) in Silicon – Electroluminescence for Analysis of Electronic Circuit and Device Functionality - Picosecond Imaging Circuit Analysis – PICA - Thermal Defect Detection Techniques - Thermal Failure Analysis by IR Lock-in Thermography - Beam-Based Defect Localization Methods - Principles of Thermal Laser Stimulation Techniques - Introduction to Laser Voltage Probing (LVP) of Integrated Circuits - SEM and FIB Passive Voltage Contrast - Electron Beam Probing - Delayerimg Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping - Plasma Delayering of Integrated Circuits - The Art of Cross Sectioning - Delineation Etching of Semiconductor Cross Sections - Special Techniques for Backside Deprocessing - Deprocessing Techniques for Copper, Low K, and Soi Devices - PCB SMT Solder Joint Failure Analysis - Improved Methodologies for Identifying Root-Cause of Printed Board Failures - Optical Microscopy - Scanning Electron Microscopy - Ultra-high Resolution in the Scanning Electron Microscope - Focused Ion Beam (FIB) Systems: A Brief Overview - Transmission Electron Microscopy for Failure Analysis of Integrated Circuits - Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy - Energy Dispersive X-ray Analysis - Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) - SIMS Solutions for Next Generation IC Processes and Devices - Submicron CMOS Devices - Reliability and Quality Concepts for Failure Analysts - CAD Navigation in FA and Design/Test Data for Fast Fault Isolation - Best of the EDFAS Email Discussion Forum 2000-2004 - Failure Analysis Roadmaps - Assembly Analytical Forum Analytical Tool Roadmap ISTFA 2003 Rev 0 White Paper - Education and Training for the Analyst - Managing the Unpredictable – A Business Model for Failure Analysis Service - Management Principles and Practices for the Failure Analysis Laboratory - Failure Analysis Terms and Definitions - JEDEC Standards for Failure Analysis - Education/Training Sources and References - ISTFA Subject Index "

"Contents : - Foreword - The Microelectronics Desk Reference - System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in today’s High Speed Low Cost PC environment - Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products - Failure Analysis Flow for Package Failures - Wafer Level Failure Analysis Process Flow - Flip-Chip and “Backside” Sample Preparation Techniques - Failure Analysis in a Fabless/Outsourced World - Circuit Edit at First Silicon - The Process of Editing Circuits Through the Bulk Silicon - Curve Tracer Data Interpretation for Failure Analysis - A Primer on Simple Device Problems and Curve Tracer Characteristics - Electronics and Failure Analysis - Analog Device and Circuit Characterization - IC Testing: Background, Directions and Opportunities for Failure Analysis - Using Scan Based Techniques for Fault Isolation in Logic Devices - The Power of Semiconductor Memory Failure Signature Analysis - Common Defects Encountered During Semiconductor Manufacturing - System Level Board Fabrication and Assembly Process Anomalies and Associated Failures Categories - Characterization of Anomalies in Flip-Chip Solder Joins in Ceramic Packaging - Identification of Latent Defects in Advanced Glass Ceramic MCM Packaging 181 Electrostatic Discharge (ESD) and Latchup Failures in Advanced CMOS Technologies - Electrical and Optical Characterization of Latchup - Failure Analysis of Microelectromechanical Systems (MEMS) - Failure Analysis of Passive Components - Failure Analysis and Reliability of Optoelectronic Devices - Die-level Fault Localization with X-ray Microscopy - X-ray Microtomography Tools for Advanced IC Packaging Failure Analysis - Acoustic Microscopy of Semiconductor Packages - Electronic Package Fault Isolation Using TDR - Current Imaging using Magnetic Field Sensors - Chip access techniques - Low Stress FA Sample Preparation of Flip Chip Devices with Low-K Dielectric Interconnect Layers - Plastic BGA Module FA Process Flow Development - Chip-Scale Packages and Their Failure Analysis Challenges - Backside Analysis Using Re-Package Techniques - Photon Emission Microscopy - Fundamentals of Photon Emission (PEM) in Silicon – Electroluminescence for Analysis of Electronic Circuit and Device Functionality - Picosecond Imaging Circuit Analysis – PICA - Thermal Defect Detection Techniques - Thermal Failure Analysis by IR Lock-in Thermography - Beam-Based Defect Localization Methods - Principles of Thermal Laser Stimulation Techniques - Introduction to Laser Voltage Probing (LVP) of Integrated Circuits - SEM and FIB Passive Voltage Contrast - Electron Beam Probing - Delayerimg Techniques: Dry Processes Wet Chemical Processing and Parallel Lapping - Plasma Delayering of Integrated Circuits - The Art of Cross Sectioning - Delineation Etching of Semiconductor Cross Sections - Special Techniques for Backside Deprocessing - Deprocessing Techniques for Copper, Low K, and Soi Devices - PCB SMT Solder Joint Failure Analysis - Improved Methodologies for Identifying Root-Cause of Printed Board Failures - Optical Microscopy - Scanning Electron Microscopy - Ultra-high Resolution in the Scanning Electron Microscope - Focused Ion Beam (FIB) Systems: A Brief Overview - Transmission Electron Microscopy for Failure Analysis of Integrated Circuits - Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy - Energy Dispersive X-ray Analysis - Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) - SIMS Solutions for Next Generation IC Processes and Devices - Submicron CMOS Devices - Reliability and Quality Concepts for Failure Analysts - CAD Navigation in FA and Design/Test Data for Fast Fault Isolation - Best of the EDFAS Email Discussion Forum 2000-2004 - Failure Analysis Roadmaps - Assembly Analytical Forum Analytical Tool Roadmap ISTFA 2003 Rev 0 White Paper - Education and Training for the Analyst - Managing the Unpredictable – A Business Model for Failure Analysis Service - Management Principles and Practices for the Failure Analysis Laboratory - Failure Analysis Terms and Definitions - JEDEC Standards for Failure Analysis - Education/Training Sources and References - ISTFA Subject Index "

"Laporan ini dibuat untuk memaparkan prosedur pengendalian internal pada perusahaan yang terkait kepada siklus penjualan dan pendapatan PT S J A Plastics Indonesia Pembahasan dimulai dari analisis pengendalian internal siklus penjualan dan pendapatan yang dimiliki PT S J A Plastics Indonesia Pembahasan akan mengungkapkan sistem informasi akuntansi yang dimiliki kunci pengendalian risiko yang dihadapi perusahaan temuan temuan yang terjadi terkait pengendalian internal serta solusi yang ditawarkan.

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The focus of this report is to explain the internal control within company that control both sales and revenue cycle of PT S J A Plastics Indonesia The discussion starts with the analysis of internal control of sales and revenue cycle of PT S J A Plastics Indonesia Description shows the accounting information system that the company has key control the risks the audit findings regarding internal control as well as the solutions offered."

"Ampas singkong merupakan limbah padat singkong yang tidak dimanfaatkan lagi, dengan penambahan PVac sebagai perekat dan gliserol sebagai plastisizer diharapkan mampu menghasilkan plastik biodegradable yang mudah terurai. Penelitian ini bertujuan untuk mengetahui karakteristik dan kekuatan tarik dari plastik biodegradable berbahan dasar ampas singkong. Ampas dan PVac divariasikan dengan perbandingan 9:1; 8:2; 7:3 dan 6:4. Hasil pengujian tarik menunjukkan, plastik 6:4 mempunyai kekutan tarik 0.1019 ± 0.339 dan regangan maksimum 26.178%. Sedangkan plastik 9:1 kekuatan tarik dan regangan maksimumnya, 0.1659 ± 0.035 dan 22.386%.

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Cassava waste can be used with the addition of PVac (as bonding agent) and glycerol (as plastisizer) to make a biodegradable plastics. This research investigated the physical characteristic and tensile strength of cassava waste based biodegradable plastics. Cassava waste and PVac ratio were varied into 9:1, 8:2, 7:3 and 6:4. Tensile test showed that 6:4 ratio, tensile strength 0.1019 ± 0.339 and maximum strain 26.178%. Furthermore 9:1, tensile strength and maximum strain were 0.1659 ± 0.035 and 22.386%."