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Ditemukan 13522 dokumen yang sesuai dengan query
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"Contents :
- Recent Developments in Weldability Testing for Advanced Materials
- Reactive Air Brazing for High-Temperature Electrochemical Applications
- The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on
Silver-Based Filler Metal Compositions
- Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High
Strength Steels
- Important Lessons Learnt in the Design of Consumables for Welding High
Strength Steels
- The Development of a Compressive Residual Stress Around a Structural Steel
Weld by Means of Phase Transformations
- Micro Electron Beam Welding in an SEM
- Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s
Corrosion Resistance
- The Effect of Surface Tension on Microjoining
- Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating
- Room Temperature Lead-Free Soldering of Microelectronic Components using a
Local Heat Source
- Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder
and Au/Ni-Co Plating
- Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution
- Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure
Development in Laser Surface Melting of Single Crystal Superalloys
- Weldability of Ni-Base Single Crystal Superalloys
- Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111
- Designing Sealing Glasses for Solid Oxide Fuel Cells
- Glass-Ceramics for Sealing Solid Oxide Fuel Cells
- Compressive Mica Seals for Solid Oxide Fuel Cells
- High Temperature Seals for Solid Oxide Fuel Cells (SOFC)
- A New Sealing Concept for Planar Solid Oxide Fuel Cells
- Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd:
YAG Laser Irradiation
- Damage Control of Soldering Iron Tip for Lead-Free Solder
- Resistance Microwelding of Fine Nickel Wires
- Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding
Conditions -
- YAG Laser and TIG Arc Hybrid Welding Phenomena
- Effect of Joint Design on Mechanical Properties of AL7075 Weldment
- Properties of Weld Joints of Bake-Hardening Steel for Automobile
- Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-
Industry Design Project Collaboration
- Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base
Metal
- Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-
Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land "
Materials Park, Ohio: ASM International, 2005
e20442560
eBooks  Universitas Indonesia Library
cover
Chichester: John Wiley & Sons, 1991
620.112 SPE
Buku Teks SO  Universitas Indonesia Library
cover
New York: John Wiley & Sons, 1978
620.112 ADV
Buku Teks SO  Universitas Indonesia Library
cover
Kumar, Kamal
New Delhi: Khanna, 1979
620.11 KUM a
Buku Teks SO  Universitas Indonesia Library
cover
Switzerland: Trans Tech, 2011
050 AMR 277 (2011) (1)
Majalah, Jurnal, Buletin  Universitas Indonesia Library
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Boresi, Arthur P. (Arthur Peter), 1924-
New York: John Wiley & Sons, 1993
620.112 BOR a
Buku Teks SO  Universitas Indonesia Library
cover
Krivovichev, Sergey V., editor
"This book is a collection of papers that are devoted to various aspects of interactions between mineralogy and material sciences. It will include reviews, perspective papers and original research papers on mineral nanostructures, biomineralization, micro- and nanoporous mineral phases as functional materials, physical and optical properties of minerals, etc. "
Heidelberg : Springer, 2012
e20405465
eBooks  Universitas Indonesia Library
cover
"The text discusses synthesis, processing, design, simulation and characterization of biomaterials for biomedical applications. It synergizes exploration related to various properties and functionalities in the biomedical field through extensive theoretical and experimental modeling. It further presents advanced integrated design and nonlinear simulation problems occurring in the biomedical engineering field. It will serve as an ideal reference text for senior undergraduate and graduate students, and academic researchers in fields including biomedical engineering, mechanical engineering, materials science, ergonomics, and human factors.
The book:
Employs a problem-solution approach, where, in each chapter, a specific biomedical engineering problem is raised and its numerical, and experimental solutions are presented
Covers recent developments in biomaterials such as OPMF/KGG bio composites, PEEK-based biomaterials, PF/KGG biocomposites, oil palm mesocarp Fibre/KGG biocomposites, and polymeric resorbable materials for orthopedic, dentistry and shoulder arthroplasty applications
Discusses mechanical performance and corrosive analysis of biomaterials for biomedical applications in detail
Presents advanced integrated design and nonlinear simulation problems occurring in the biomedical engineering field
Presents biodegradable polymers for various biomedical applications over the last decade owing to their non-corrosion in the body, biocompatibility and superior strength in growing state
Synergizes exploration related to the various properties and functionalities in the biomedical field through extensive theoretical and experimental modeling"
Boca Raton: CRC Press, 2022
e20534070
eBooks  Universitas Indonesia Library
cover
Attman, Osman
New York: McGraw-Hill, 2010
720.47 ATT g
Buku Teks SO  Universitas Indonesia Library
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Timoshenko, Stephen P.
New York: Robert E. Kreiger, 1976
620.11 TIM s
Buku Teks SO  Universitas Indonesia Library
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