Hasil Pencarian  ::  Simpan CSV :: Kembali

"Get "Up and running" with AutoCAD using Gindis’s combination of step-by-step instruction, examples, and insightful explanations. The emphasis from the beginning is on core concepts and practical application of AutoCAD in architecture, engineering and design. Equally useful in instructor-led classroom training, self-study, or as a professional reference, the book is written with the user in mind by a long-time AutoCAD professional and instructor based on what works in the industry and the classroom."

"The book describes recent research results in the areas of modelling, creation, management and presentation of interactive 3D multimedia content. The book describes the current state of the art in the field and identifies the most important research and design issues. These are, database modelling of 3D content, security in 3D environments, describing interactivity of content, searching content, visualization of search results, modelling mixed reality content, and efficient creation of interactive 3D content. Each chapter is illustrated with example applications based on the proposed approach. The final chapter discusses some important ethical issues related to the widespread use of virtual environments in everyday life. "

"3D Printing adalah metode manufaktur aditif yang menciptakan objek 3D dari model digital. Objek dibuat secara layer-by-layer dengan material seperti plastik, logam, atau bahan organik pada sebuah bed printer. Untuk objek yang lebih besar dari ukuran bed printer, mereka dibagi menjadi beberapa bagian dan disambung menggunakan metode interlocking. Penelitian ini menguji empat jenis balok (U beam, I beam, bar beam, dan hollow beam) yang terbuat dari bahan High Strength Low Alloy (HSLA) dengan tiga jenis pembebanan (lentur, aksial, dan puntir). Mekanisme interlocking menggunakan pengunci male-to-female dengan variasi panjang pengunci male. Analisis tegangan dilakukan menggunakan perangkat lunak Autodesk Inventor. Hasil penelitian menunjukkan mekanisme terbaik: U beam - panjang male locker 10 cm dengan posisi pengencang 5 cm dari pangkal; bar beam dan I beam model 1 - panjang male locker 10 cm dengan posisi pengencang 1,67 cm dari pangkal; H model 2 - panjang male locker 20 cm dengan posisi pengencang 13,33 cm dari pangkal; dan hollow beam - panjang male locker 5 cm dengan posisi pengencang 1,67 cm dari pangkal. Panjang dan posisi ini menghasilkan faktor keamanan terbesar, sehingga cocok untuk aplikasi dengan beban tersebut.

---

3D Printing is an additive manufacturing method that creates 3D objects from a digital model. Objects are built layer-by-layer using materials like plastic, metal, or organic matter on a printer bed. For objects larger than the printer bed, they are divided into sections and joined using interlocking methods. This research tested four types of beams (U beam, H beam, bar beam, and hollow beam) made from High Strength Low Alloy (HSLA) material with three types of loading (bending, axial, and torsion). The interlocking mechanism used male-to-female locking with variations in the male locker length. Stress analysis was conducted using Autodesk Inventor software. Results showed the best mechanisms: U beam - male locker length of 10 cm with the fastener position 5 cm from the base; bar beam and H beam model 1 - male locker length of 10 cm with the fastener position 1.67 cm from the base; H beam model 2 - male locker length of 20 cm with the fastener position 13.33 cm from the base; and hollow beam - male locker length of 5 cm with the fastener position 1.67 cm from the base. These lengths and positions yielded the largest safety factors, making them suitable for applications with those loads."

"This book is about how to use computer software to manufacture and test virtually semiconductor devices in 3D. It brings to life the topic of semiconductor device physics, with a hands-on, tutorial approach that de-emphasizes abstract physics and equations and emphasizes real practice and extensive illustrations. Coverage includes a comprehensive library of devices, representing the state of the art technology, such as SuperJunction LDMOS, GaN LED devices, etc."