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"Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead free solder : mechanics and reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests."

"Perkembangan industri elektronik di Indonesia semakin maju pesat dan tentunya membutuhkan tingkat akurasi produksi yang tinggi serta proses yang ramah terhadap lingkungan. Paduan solder SnPb perlu ditinjau karena sudah dilarang pengunaanya mulai 1 juli 2006 di negara maju mengingat sifat toxic Pb yang sangat berbahaya. Sebagai salah satu alternatif untuk mengganti unsur Pb maka dilakukan modifikasi unsur Zn yang dipadukan dengan unsur timah (Sn) dan tembaga(Cu) untuk memperoleh sifat fisik dan mekanik yang mendekati sifat SnPb. Metoda penggabungan secara metalurgi pada proses pembasahan dengan dasar sudut kontak dan pencapaian suhu solidus juga sebagai bentuk karakterisasi yang diperlukan. Pengujian dilakukan terhadap paduan terner Sn-0.7Cu-xZn dengan metoda peleburan Sn dan Cu yang dilanjutkan dengan penambahan variasi unsur Zn 22,24;19,37;16,47,15,14;14,29 dan 9,08 % dan dilakukan pengujian temperatur leleh (DSC test) serta pengujian pemanasan diatas tembaga,, mampu basah (wettability), tegangan geser (shear stress),kerapatan massa(density), kekerasan mikro dan makro(Micro and Macro hardness), dan pengamatan struktur mikro. Hasil pengujian menunjukkan bahwa penambahan kandungan Zn pada paduan terner berbasis Sn-0.7Cu-xZn akan menurunkan temperatur leleh secara signifikan. Kekuatan geser paduan terner terbesar diperoleh pada penambahan 9,08% Zn serta terkecil diperoleh pada penambahan 22,24 % Zn. Tingkat kekerasan paduan terner Sn0.7CuxZn terbesar diperoleh pada prosentase 22,24 % Zn dan terkecil diperoleh pada prosentase 9,08% Zn. Adapun dari pengamatan struktur mikro terlihat bahwa sebaran fasa intermetalik Cu3Sn dan fasa eutektik Sn cukup signifikan terjadi pada paduan Sn0.7CuxZn;

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Electronic industrial has developed rapidly as customer consumption. So that for an accuracy level and environmentally friendly is needed as base on production process. SnPb soldering is banned in developed country since july 2006, then the aim is to explore the material which have to eliminate Pb by using other free lead element to void toxic of lead solder as human health and environment protection. One of the potential element was studied is Zinc alloyed Tin and Copper on variety composition of Zinc. The method was carried out by using XRD measurement, microstructure observation and melting point tested to analyses hardness, shear strength and wettability behavior.

Experimentally as shown that increasing of Zn (22,24;19,37;16,47;15,14;14,29 and 9,08) has effect to physically and mechanical properties. Shear stress on terner alloys has higher value in 22,24%Zn, and lower value in 14,29%Zn. Hardness level on terner alloys has higher value in 14,29%Zn and lower value in 12%Zn. Melting point has decreasing in increasing of Zinc content. Metallography observation has identified that intermetalic Cu3Sn and eutectic Sn are scattered in Sn0.7CuxZn alloy."

"Paduan timah-timah (Sn-Pb) adalah yang paling banyak digunakan di Indonesia sebagai bahan solder. Timbal adalah unsur beracun dan harus diganti oleh unsur lain. Tujuan dari Penelitian ini mempelajari bahan solder bebas timbal Sn-Zn dengan berbagai konten Zn. Timah diperoleh dari Pulau Bangka. Sampel dikarakterisasi dengan cara Difraktometer Sinar-X, penganalisis termal, dan Potensiodinamik. Hasilnya menunjukkan bahwa dengan berbagai konten Zn yang berbeda, struktur tetragonal tetap berpusat pada Tubuh. Konten Zn yang berbeda dalam Paduan Sn-Zn telah mengubah titik lebur dan entalpi. Tes Polarisasi Potensiodinamik menunjukkan bahwa Sn-Zn berbeda kandungan Zn stabil secara kimiawi. Dapat disimpulkan bahwa Paduan Sn-Zn dapat digunakan sebagai salah satu di antara solder bebas timah lainnya. Kandungan Zn lebih rendah dari eutektik konsentrasi menghasilkan laju korosi terkecil.Paduan timah-timah (Sn-Pb) adalah yang paling banyak digunakan di Indonesia sebagai bahan solder. Timbal adalah unsur beracun dan harus diganti oleh unsur lain. Tujuan dari Penelitian ini mempelajari bahan solder bebas timbal Sn-Zn dengan berbagai konten Zn. Timah diperoleh dari Pulau Bangka. Sampel dikarakterisasi dengan cara Difraktometer Sinar-X, penganalisis termal, dan Potensiodinamik. Hasilnya menunjukkan bahwa dengan berbagai konten Zn yang berbeda, struktur tetragonal tetap berpusat pada Tubuh. Konten Zn yang berbeda dalam Paduan Sn-Zn telah mengubah titik lebur dan entalpi. Tes Polarisasi Potensiodinamik menunjukkan bahwa Sn-Zn berbeda kandungan Zn stabil secara kimiawi. Dapat disimpulkan bahwa Paduan Sn-Zn dapat digunakan sebagai salah satu di antara solder bebas timah lainnya. Kandungan Zn lebih rendah dari eutektik konsentrasi menghasilkan laju korosi terkecil.

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Lead-complaint (Sn-Pb) is the most widely used in Indonesia as a solder. Lead is a poisonous element and must be replaced by other elements. The purpose of this research is to study Sn-Zn lead free solder with various contents Zn. Tin is obtained from Bangka Island. Samples were characterized by X-ray Difractometer, thermal analyzer, and Potentiodynamics.

The results show that with a variety of different Zn content, the tetragonal structure remains centered on the Body. The different Zn content in the Sn-Zn Alloy has changed the melting point and enthalpy. Potentiodynamic Polarization Tests showed that Sn-Zn differed chemically stable Zn content.

It can be concluded that the Sn-Zn Alloy can be used as one of the other lead-free solder. Zn content is lower than eutectic concentration produces the smallest corrosion rate. The combination of lead (Sn-Pb) is the most widely used in Indonesia as a solder. Lead is a poisonous element and must be replaced by other elements.

The purpose of this research is to study Sn-Zn lead free solder with various Zn contents. Tin is obtained from Bangka Island. Samples were characterized by X-ray Difractometer, thermal analyzer, and Potentiodynamics. The results show that with a variety of different Zn content, the tetragonal structure remains centered on the Body. The different Zn content in the Sn-Zn Alloy has changed the melting and enthalpy points.

Potentiodynamic Polarization Tests showed that Sn-Zn differed chemically stable Zn content. It can be concluded that the Sn-Zn Alloy can be used as one of the other lead-free solder. The lower Zn content than the eutectic concentration produces the smallest corrosion rate."

"Masalah kontaminasi lingkungan yang diakibatkan oleh penggunaan timbal menjadi perhatian yang serius beberapa tahun belakangan ini. Persoalan ini kemudian menggerakkan para pelaku industri untuk perlahan-lahan meninggalkan material solder yang mengandung timbal dan mengembangkan alternatif material solder yang bebas timbal, diantaranya paduan Sn-Cu. Dalam penelitian tugas akhir ini, paduan Sn-Cu dibuat dengan menggunakan lnetode peleburan yang dilakukan pada atmosfer nitrogen. Variasi sampel paduan yang dibuat adalah paduan hypoeutektik, eutektik dan hypereutektik Sn-Cu. Dari hasil karakterisasi XRD memperlihatkan bahwa puncak-puncak utama yg teridentifikasi merupakan milik β-Sn dengan struktur Kristal tetragonal dengan disertai pertumbuhan puncak yang dimiliki senyawa intennetalik Cu6Sn5. Karakterisasi termal dari semua paduan yang didapatkan rnenggunakan DSC menunjukkan penurunan titik lebur paduan Sn-Cu keseluruhan akibat penambahan Cu. Ini terlihat dari besarnya titik lebur paduan Sn99.8%-Cu0.2% yaitu 224.5°C kemudian menurun menjadi 220.1°C pada paduan Sn98.1%-Cu1.9%. Pengaruh penambahan Cu juga terlihat pada sifat kekerasan dari semua variasi paduan Sn-Cu yaitu kekerasan paduan meningkat seiring Cu yang bertambah pada paduan. Hal ini dikonfirmasi dari hasil test menggunakan vicker hardness fest. Peningkatan ini cukup signifikan yaitu dari 0.56 kgf/mm2 pada paduan Sn99.8%-Cu0.2% menjadi 41.2 kgf/mm2 pada paduan Sn98.1%-Cu1.9%. Kenaikan nilai kekerasan ini diakibatkan oleh pembentukan senyawa intermetalik Cu6Sn5 sebagaimana dibuktikan dari hasil XRD.

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Environment contamination issue caused by lead utilization had become a serious interest for years back then. This issue afterwards, force industrial performer to slowly leaves solder material based on lead and developed lead-free solder materials. Sn-Cu alloys on this thesis paper have been done using fusion method within nitrogen atmosfer. All variation made consist of hypoeutectic, eutectic and hypereutectic Sn-Cu alloy.

Structural characterization for all variation shows that primary peaks that observed have been identiyied as ,β-Sn peak with growth of intermetallic compound Cu6Sn5 peak. Thermal studies using DSC revealed that addition of Cu could lowering melting point ofSn-Cu totally. Lowering of melting point can be seen from Sn99.8%-Cu0.2% alloy which have 224.5°C decrease to 220.1°C for Sn98.1%-Cu1.9% alloy. Cu addition also have impact to raise hardness value of Sn-Cu alloy obtain from Wckers Hardness test. Hardness value of Sn99.8%-Cu0.2% alloy raise significantly from 0.56 kgf/mm2 to 41.2 kgf/mm2 for Sn98.1%-Cu1.9%. Increase on this hardness value caused by growth of intermetallic compound Cu6Sn5 when increasing Cu, which this result correspond with XRD result."

"ABSTRAKPengembangan bahan solder bebas timbal menjadi hal penting, sejak penerapan RoHS. Namun, beberapa kandidat untuk solder bebas timbal memiliki beberapa kelemahan seperti banyak pertumbuhan intermetalik (IMC), dan titik lebur yang sedikit lebih tinggi. Salah satu metode yang digunakan untuk membuat solder bebas timbal adalah dengan menambahkan elemen paduan lainnya. Salah satu elemen paduan yang menjanjikan adalah dengan memvariasikan konten Bismuth (Bi). Differential Scanning Calorimetry, Difraksi sinar-X dan Potensiodinamik digunakan untuk karakterisasi. Hasilnya menunjukkan bahwa titik leleh berkurang. Struktur Sn yang di doping Bi menunjukkan fase tunggal tetragonal Sn dan parameter kristal yang berbeda. Dari uji potensiodinamik, sampel menunjukkan laju korosi yang berbeda. Kesimpulannya, solder bebas timbal Sn-Bi berpotensi sebagai kandidat untuk menggantikan bahan solder timah yang bebas timbal.

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ABSTRACT

The development of lead free solder materials has become urgent, since the implementation of RoHS. However, some candidates for lead free solder have several weaknesses such as many of intermetallic growth (IMC), slightly higher of melting point. One of the methods used to make lead free solder is by the addition of other alloying element. One of the promising alloying elements is by varying Bismuth (Bi) content. Differential Scanning Calorimetry, X ray Difraction and Potensiodynamic were used for characterization. The results show the melting point reduced. The structure of Bi doped Sn show single phase tetragonal Sn and different crystal parameter have been obtained. From Potensiodynamic test, The samples show different corrosion rate. In conclusion, Sn-Bi lead free solder is potential candidat for replacing Lead-free solder materials."

"This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. The results of these studies have been reported rather sporadically at various technical conferences."

"Power electronic packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. The book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions."

"Ecological restrictions in many parts of the world are demanding the elimination of Pb from all consumer items. At this moment in the piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics is to provide a comprehensive overview of the fundamentals and developments in the field of lead-free materials and products to leading researchers in the world. The text presents chapters on demonstrated applications of the lead-free materials, which will allow readers to conceptualize the present possibilities and will be useful for both students and professionals conducting research on ferroelectrics, piezoelectrics, smart materials, lead-free materials, and a variety of applications including sensors, actuators, ultrasonic transducers and energy harvesters."