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Ditemukan 10999 dokumen yang sesuai dengan query
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"[This book reports on the DEXMART research project, which sought to fill the gap between the use of dexterous and autonomous dual-hand manipulative robots in industrial environments and the use of future robots in everyday human and unstructured environments. , This book reports on the DEXMART research project, which sought to fill the gap between the use of dexterous and autonomous dual-hand manipulative robots in industrial environments and the use of future robots in everyday human and unstructured environments. ]"
Berlin : [Springer, ], 2012
e20397727
eBooks  Universitas Indonesia Library
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Harrison, F.L.
England: Gower, 1985
658.404 HAR a
Buku Teks  Universitas Indonesia Library
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Moise, Edwin E.
Reading, MA: Addison-Wesley, 1990
516.2 MOI e
Buku Teks  Universitas Indonesia Library
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Enoch, Stefan, editor
"This book deals with all aspects of plasmonics, basics, applications and advanced developments. Plasmonics is an emerging field of research dedicated to the resonant interaction of light with metals. The light/matter interaction is strongly enhanced at a nanometer scale which sparks a keen interest of a wide scientific community and offers promising applications in pharmacology, solar energy, nanocircuitry or also light sources. The major breakthroughs of this field of research originate from the recent advances in nanotechnology, imaging and numerical modelling. The book is divided into three main parts, extended surface plasmons polaritons propagating on metallic surfaces, surface plasmons localized on metallic particles, imaging and nanofabrication techniques. The reader will find in the book: Principles and recent advances of plasmonics, a complete description of the physics of surface plasmons, a historical survey with emphasize on the emblematic topic of Wood's anomaly, an overview of modern applications of molecular plasmonics and an extensive description of imaging and fabrications techniques."
Berlin : Springer, 2012
e20424875
eBooks  Universitas Indonesia Library
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"This book presents state-of-the-art experimental and modelling techniques for skin biophysics that are currently used in academic and industrial research. It also identifies current and future challenges, as well as a growing number of opportunities in this exciting research field. The book covers the basics of skin physiology, biology, microstructural and material properties, and progressively introduces the reader to established experimental characterisation protocols and modelling approaches. Advanced topics in modelling theories and numerical implementation are also presented.
The book focusses especially on:
1. Basic physiology, molecular biology, microstructural and material properties of the skin.
2. Experimental characterisation techniques for the skin (including imaging): in vivo and in vitro techniques and combination of those with in silico approaches.
3. State-of-the-art constitutive models of the skin: elastic, anelastic and mechanobiological formulations (e.g. growth, ageing, healing).
4. Applications: mechanics, damage, biological growth, healing, ageing and skin tribology."
Switzerland: Springer Fachmedien Wiesbaden, 2019
e20509782
eBooks  Universitas Indonesia Library
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Cohen, Elaine L.
St. Louis: Elsevier, 2005
362.1 Coh n
Buku Teks  Universitas Indonesia Library
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Fischer, Wolfgang
"The book presents the fundamental results and methods of complex analysis and applies them to a study of elementary and non-elementary functions (elliptic functions, Gamma- and Zeta function including a proof of the prime number theorem ...) and - a new feature in this context! - to exhibiting basic facts in the theory of several complex variables."
Wiesbaden: Vieweg+Teubner Verlag, 2012
e20418884
eBooks  Universitas Indonesia Library
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"Contents :
- Recent Developments in Weldability Testing for Advanced Materials
- Reactive Air Brazing for High-Temperature Electrochemical Applications
- The Effect of High-Temperature Dual Reducing/Oxidizing Gas Conditions on
Silver-Based Filler Metal Compositions
- Development of Hyper-Interfacial Bonding Process of Ultra-Fine Grained High
Strength Steels
- Important Lessons Learnt in the Design of Consumables for Welding High
Strength Steels
- The Development of a Compressive Residual Stress Around a Structural Steel
Weld by Means of Phase Transformations
- Micro Electron Beam Welding in an SEM
- Nd-YAG Laser Micro Welding of Ti-Ni Type Shape Memory Alloy Wire and it’s
Corrosion Resistance
- The Effect of Surface Tension on Microjoining
- Interfacial Reaction Between Sn-8Zn-3Bi and Ni/Au Plating
- Room Temperature Lead-Free Soldering of Microelectronic Components using a
Local Heat Source
- Study for Increasing in the Melting Temperature of Micro Joint using Sn-Ag Solder
and Au/Ni-Co Plating
- Microstructural Characterization of Eutectic Sn-Au Solder as a Lead-free Solution
- Effects of Melt-Pool Geometry and Substrate Orientation on Microstructure
Development in Laser Surface Melting of Single Crystal Superalloys
- Weldability of Ni-Base Single Crystal Superalloys
- Microstructure of Laser Deposited Superalloy RENE 80 on GTD-111
- Designing Sealing Glasses for Solid Oxide Fuel Cells
- Glass-Ceramics for Sealing Solid Oxide Fuel Cells
- Compressive Mica Seals for Solid Oxide Fuel Cells
- High Temperature Seals for Solid Oxide Fuel Cells (SOFC)
- A New Sealing Concept for Planar Solid Oxide Fuel Cells
- Effects of Surface Microstructure of Copper on Surface Energy after Pulse Nd:
YAG Laser Irradiation
- Damage Control of Soldering Iron Tip for Lead-Free Solder
- Resistance Microwelding of Fine Nickel Wires
- Novel Bonding Process Using Ag Nanoparticles - Influence of Bonding
Conditions -
- YAG Laser and TIG Arc Hybrid Welding Phenomena
- Effect of Joint Design on Mechanical Properties of AL7075 Weldment
- Properties of Weld Joints of Bake-Hardening Steel for Automobile
- Lead-Free Soldering of a Hybrid Microcircuit Package Assembly: A University-
Industry Design Project Collaboration
- Effect of Ni Addition on Interfacial Reaction between Sn-Cu Solder and Cu Base
Metal
- Effect of Au Coating Thickness on Interfacial Reaction and Joint Strength of Sn-
Ag Based Solders Reflowed on Electroless Ni-P/Au Plated Cu land "
Materials Park, Ohio: ASM International, 2005
e20442560
eBooks  Universitas Indonesia Library
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