Hasil Pencarian  ::  Simpan CSV :: Kembali

"Contents :- Keynote Presentation - Breakup Sequence of the TWA Flight 800 Airplane: How it was Determined That an Explosion of the Wing Center Section Fuel Tank Initiated the Breakup - Session 1: Advanced Techniques - Micro-Raman Spectroscopy Evaluation of the Local Mechanical Stress in Shallow Trench Isolation CMOS Structures: Correlation With Defect Generation and Diode Leakage - Microthermal Imaging Based on the Transmission Change of a Thermochromic Dye Film - High Spatial Resolution OBIRCH and OBIC Effects Realized by Near-Field Optical Probe in the Analysis of High Resistance 200 nm wide TiSi Line - Advanced Failure Analysis of Deep-Submicron CMOS Device Dopant Profiles Using Scanning Kelvin Probe Microscopy - Scanning Capacitance Microscopy use in the Failure Analysis of Vcc Shorts in an Advanced Microprocessor - Session 2: FIB I - Focused Ion Beam Irradiation Induced Damages on CMOS and Bipolar Technologies - AC Hot-Carrier Effects Characterization by Circuit Modification Using Focused Ion Beam - Performing Circuit Modification and Debugging Using Focused-Ion-Beam on Multi-Layered C4 Flip-Chip Devices - Focused Ion Beam Application in Solving RFIC Oscillation Problem - Session 3: Military - The RAC Data Sharing Consortium: Sharing Test, Field and Failure Analysis Data - Failure Analysis of a Qualification Unit Injector for a Satellite Thruster - Preliminary Study of Alternative Material Development of Ballistic Attributes - Metallurgical Examination of a Galled PH 13-8 Mo Stainless Steel Main Rotor Sub-Assembly - Effects of Prior Processing on the Performance of PH 13-8 Mo Stainless Steel - Session 4: FIB II - In-Situ Electrical Monitoring and Contactless Measurement Techniques for Enhanced FIB Modifications - The Challenges of FIB Chip Repair & Debug Assistance in the 0.25 um Copper Interconnect Millennium - A Selected Area Planar TEM (SAPTEM) Sample Preparation Procedure for Failure Analysis of Integrated Circuits - Session 5: ESD - ESD Induced Failures in Cermet Trim Potentiometers - Basic Physics in Color-Coded EOS Metallization Failures (Differentiating Between EOS and ESD) - ESD Induced Failure of an Internal MOSFET in a Mixed Signal IC due to Two Different Power Supplies - Session 6: Techniques I - An Effective and Practical Analysis Technique for Open Defect Isolation at IDD Leakage Failure by Observing Transient Photo Emission - Thermally Assisted Photoemission for CMOS Device Analysis - Non-Contact Probing of Integrated Circuits Using Electrostatic Force Sampling - Session 7: Case History I - A Hermetic Package Internal Water Vapor Paradox: Nonconforming Product That Does Not Fail - Graphical Representation of Permanent Defects in Hard Disk Drives - Evaluation of Pt/PZT/Pt Capacitors Using Sims - Session 8: Techniques II - Evaluation of the Resistance of Individual Si Die to Cracking - Aluminum Interconnect Response to Electrical Overstress - Identification of Charging Effects in Plasma-Enhanced TEOS Deposition with Non-Contact Test Techniques - Session 9: Case History II - Passive Voltage Contrast Technique for Rapid In-Line Characterization and Failure Isolation During Development of Deep-Submicron ASIC CMOS Technology - Failure Analysis Case Study of PALs Used in the Flight Control Circuitry of Paveway III Laser Guided Bombs - ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement - Session 10: Testing - Realistic Database for Semiconductor Device Analysis - Auto-Fault-Locating-System for Mounting Boards - Faster Defect Localization with a New Development of IDDQ - Session 11: Case History III - A Study on Discolored Bondpads and Galvanic Corrosion - Investigation of High Via Resistance of a 0.25 um CMOS ASIC Technology - Electromigration in Gold Line of GaAs IC - Session 12: Poster Sessions - Investigations of Leakage Paths in Sub-0.35 um DRAM Products Using Advanced Focused Ion Beam Techniques - Non-Destructive Chemical Decapsulation Techniques for TBGA Package Devices - Techniques to Remove the C4 Die from a Ceramic Package - Simple Flip Chip Analysis Strategies - The Logic Mapper - Making the Most of the Internet for Failure Analysis - High-Yield and High-Throughput TEM Sample Preparation Using Focused Ion Beam Automation - Application of EMS Analysis to Failure in Cell Area of Memory Device - Session 13: Discretes - Reduced Device Life Caused by Flux Entrapment During the Construction Process - Mechanical/Plasma Decapsulation Method and Thermal Finite-Element Analysis Provide Explanation for SMB Zener Failures - Innovative Ap"

"This book constitutes the refereed proceedings of the 7th International Conference on Pattern Recognition in Bioinformatics, PRIB 2012, held in Tokyo, Japan, in November 2012. The 24 revised full papers presented were carefully reviewed and selected from 33 submissions. Their topics are widely ranging from fundamental techniques, sequence analysis to biological network analysis. The papers are organized in topical sections on generic methods, visualization, image analysis, and platforms, applications of pattern recognition techniques, protein structure and docking, complex data analysis, and sequence analysis."