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"Based on both the Fifth International Symposium on Intelligent Distributed Computing, and the Third International Workshop on multi-agent systems technology and semantics, this volume explores the theory and applications of intelligent distributed computing and multi-agent systems."

"Contents :- A Comparitive Study of Electron and Ion Beam Induced Charge Imaging Techniques in CMOS Failure Analysis - Infrared Light Emission From Semiconductor Devices - The Use of Near-Field Scanning Optical Microscopy for Failure Analysis of ULSI Circuits - Golden Devices II: Alchemy in the 0.35 um Era - Focused Ion Beam Assisted Circuit Debug of a Video Graphics Chip - Two Unique Case Studies Performed With Photoemission Microscopy (PEM) - Application of Photoemission Microscopy and Focused Ion Beam Microsurgery to an Investigation of Latchup - Localizing Heat-Generating Defects Using Fluorescent Microthermal Imaging - A User-Friendly System for Fluorescent Microthermal Imaging and Light Emission Microscopy - Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas - X-Ray Microfocus Radioscopy and Computed Tomography for Failure Analysis - Low Resistivity FIB Depositions Within High Aspect Ratio Holes - Grains Observation Using FIB Anisotropic Etch Followed by AFM Imaging - Cross-Sectional Specimen Preparation of Fragile Failure Location in Thin-Film Transistors Using Focused Ion Beam Etching and Transmission Electron Microscope - Low Acceleration Voltage EBIC Using FESEM and Application to Cross- Sectional Junction Evaluation - Contamination Diagnosis Using Contamination-Defect-Fault (CDF) Simulation - FLOSPAT: Fault Localization by Sensitized Path Transformation - Fault Verification Simulation for Light-Emission Microscopy and Liquid-Crystal Analysis - Fault Diagnosis on the TMS320C80 (MVP) Using FastScanTM - Modeling IC Defects Using Circuit Simulation Software - Characterization of Unfilled Tungsten Plugs on a 0.35 um CMOS Multilevel Metallization Process - Failure Analysis of a Half-Micron CMOS IC Technology - Burn-in Failure Analysis of 0.5 um 1 MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug - The Application of Novel Failure Analysis Techniques and Defect Modeling in Eliminating Short Poly End-Cap Problem in Submicron CMOS Devices - Case Study: Unique Stress Induced Gate Oxide Defects in a CMOS Analog/Digital Device Revealed by Backside Silicon Removal - Risk Assessment in Signature Analysis - Signature Analysis: Statistical Models and Their Application to FA - A Signature Analysis Method for IC Failure Analysis - TEM Sample Preparation Using A Focused Ion Beam and A Probe Manipulator - Pin-Point Transmission Electron Microscopic Analysis Applied to Off-Leakage Failures of a Bipolar Transistor in 0.5 um BiCMOS Devices - TEM Cross-Sectional Analysis of ESD Induced Damage in Input Protection Circuitry - A Study of Measurement Methods for Detecting Voiding and Delamination of Die Attach Materials in Power Semiconductor Devices - Failure Analysis of the Die-Attach in a Metal-Type Package - Charge Diffusion and Reciprocity Theorems: A Direct Approach to EBIC of Ridge Laser Diodes - Characterization and Elimination of Forward Snapback Defects in GaAs Light Emitting Diodes - Temperature Dependence of Quiescent Currents as a Defect Prognosticator and Evaluation Tool - Contactless Testing of Pulse Propagation in IC's-A Comparison Between OBIC and Captive-Coupling Detection Techniques - Electron-Beam Analysis of the Turn-On Speed of Grounded-Gate NMOS ESD Protection Transistors During Charged Device-Model Stress Pulses - Contactless Function Test of Integrated Circuits on the Wafer - Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices - Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy - Signature Analysis of Package Delamination Using Scanning Acoustic Microscope - A Case Study of Post De-Tape Cleans on Mold Compound Adhesion - Spatial Evaluation of Resolution in a Scanning Ultrasonic Microscope. Microassembling Technologies Characterization: Differences Between A-Scan and C-Scan Analysis Modes - Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards - A Review of Wet Etch Formulas for Silicon Semiconductor Failure Analysis 301 Carbon Coating for Electron Beam Testing and Focus Ion Beam Reconfiguration - A Technique for Achieving Precision Cross Sections of Released Surface Micromachined Structures - The Study of ESD Destructive Mechanism for PN-Junction - Interconnect Failure Dependence on Crystallographic Structure - Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures - Mechanism Study of Contact Corrosion in Unpatterned Metal Wafer - TPLY for Yield Improvement - A New Robust Backside Flip-Chip Probing Methodology "

"This book constitutes the proceedings of the Second Enterprise Engineering Working Conference (EEWC), held in Delft, The Netherlands, during May 7-8, 2012. EEWC aims at addressing the challenges that modern and complex enterprises are facing in a rapidly changing world. The participants of the working conference share a belief that dealing with these challenges requires rigorous and scientific solutions, focusing on the design and engineering of enterprises. The goal of EEWC is to stimulate interaction between the different stakeholders, scientists as well as practitioners, interested in making enterprise engineering a reality. The eight papers presented were carefully reviewed and selected for inclusion in the book. EEWC 2012 had 20 submissions and accepted eight for publication. The topics of the presented papers allowed for active participation in interesting discussions and exchange of ideas and stimulated future cooperation among the participants. This made EEWC a real ‘working conference’ contributing to the further development of enterprise engineering as a mature discipline. Topics covered include: foundations of enterprise engineering; enterprise control, flexibility and governance and specifying value."

"This book constitutes the refereed proceedings of the 6th IFIP TC 6 International Workshop on Self-Organizing Systems, IWSOS 2012, held in Delft, The Netherlands, in March 2012. The 5 revised full papers and 5 short papers presented together with 2 invited papers were carefully selected from 25 full paper and 8 short paper submissions. The papers address the following key topics, design and analysis of self-organizing and self-managing systems, inspiring models of self-organization in nature and society, structure, characteristics and dynamics of self-organizing networks, techniques and tools for modeling self-organizing systems, robustness and adaptation in self-organizing systems, self-organization in complex networks like peer-to-peer, sensor, ad-hoc, vehicular and social networks, control of self-organizing systems, decentralized power management in the smart grid, self-organizing group and pattern formation, self-organizing mechanisms for task allocation, coordination and resource allocation, self-organizing information dissemination and content search, and risks and limits of self-organization."

""The articles in this yearbook, by British and American, Dutchand Flemish contributors, survey the living, contemporary culture of the Low Countries as well as their cultural heritage"--Foreword."

"This paper discusses the extent of eruption of Merapi volcano in 1994. It looks at the effects associated with the volcano as it erupted. The damages were inflicted on both the abiotic and biotic environments. The eruption occurred in the southern parts of the volcano. Because of the potential problems the volcano has, this has called for government involvement as an attempt to minimise the casualties. This has been done by intergovernmental cooperation for instance through the establishment of disaster prevention projects like Sobo Technical Centre, Merapi Volcano Project and the office purposely concerned with the investigation on the activities of Merapi. These projects cooperate to establish the hazard maps."